The OCZ Flex II heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each PC2-9200 Flex II memory module features thermal management technology. Combining an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s ICs, Flex II effectively dissipates heat produced by high-speed memory. This was engineered with a unique "flexible" design to give enthusiasts the option to run the modules passively or water cooled via the thick array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.
Cost and availability is unknown as of now.
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